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original creation date: 07/22/96 last update date: 10/08/99 last major revision date: 07/22/96 mnlm2940-12-x rev 1a1 microcircuit data sheet 1a low dropout regulator general description the lm2940 positive voltage regulator features the ability to source 1a of ouput current with a dropout voltage of typically 0.5v and a maximum of 1v over the entire temperature range. furthermore, a quiescent current reduction circuit has been included which reduces the ground current when the differential between the input voltage and the output voltage exceeds approximately 3v. the quiescent current with 1a of output current and an input-output differential of 5v is therefore only 30 ma. higher quiescent currents only exist when the regulator is in the dropout mode (vin - vout < 3v). designed also for vehicular applications, the lm2940 and all regulated circuitry are protected from reverse battery installations or 2-battery jumps. during line transients, such as load dump when the input voltage can momentarily exceed the specified maximum operating voltage, the regulator will automaically shut down to protect both the internal circuits and the load. the lm2940 cannot be harmed by temporary mirror-image insertion. familiar regulator features such as short circuit and thermal overload protection are also provided. ns part numbers lm2940j-12/883 lm2940k-12/883 lm2940wg-12/883 industry part number lm2940 prime die lm2940 controlling document see feature section processing mil-std-883, method 5004 quality conformance inspection mil-std-883, method 5005 subgrp description temp ( c) o 1 static tests at +25 2 static tests at +125 3 static tests at -55 4 dynamic tests at +25 5 dynamic tests at +125 6 dynamic tests at -55 7 functional tests at +25 8a functional tests at +125 8b functional tests at -55 9 switching tests at +25 10 switching tests at +125 11 switching tests at -55 1
microcircuit data sheet mnlm2940-12-x rev 1a1 features - dropout voltage typically 0.5v @ io = 1a - output current in excess of 1a - output voltage trimmed before assembly - reverse battery protection - internal short circuit current limit - mirror image insertion protection - controlling document - lm2940j-12/883 5962-9088401qea - lm2940k-12/883 5962-9088401mya - lm2940wg-12/883 5962-9088401qxa 2
microcircuit data sheet mnlm2940-12-x rev 1a1 (absolute maximum ratings) (note 1) input voltage (survival voltage <100ms) 60v internal power dissipation (note 2, 3) internally limited maximum junction temperature 150 c storage temperature range -65 c to +150 c lead temperature 300 c (soldering, 10 seconds) thermal resistance thetaja 40 c/w t03 pkg (still air) tbd t03 pkg (500lf/min air flow) 73 c/w cerdip (still air) 37 c/w cerdip (500lf/min air flow) 122 c/w ceramic soic (still air) 77 c/w ceramic soic (500lf/min air flow) thetajc 5 c/w t03 3 c/w cerdip (note 3) 5 c/w ceramic soic (note 3) package weight (typcial) tbd t03 pkg 1970mg cerdip 360mg ceramic soic esd susceptibility (note 4) 4000v note 1: absolute maximum ratings are limits beyond which damage to the device may occur. operating ratings are conditions for which the device is functional, but do not guaranteed specific performance limits. for guaranteed specifications and test conditions see the electrical characteristics. the guaranteed specifications apply only for the test conditions listed. some performance characteristics may degrade when the device is not operated under the listed test conditions. note 2: the maximum power dissipation must be derated at elevated temperatures and is dictated by tjmax (maximum junction temperature), thetaja (package junction to ambient thermal resistance), and ta (ambient temperature). the maximum allowable power dissipation at any temperature is pdmax = (tjmax - ta)/thetaja or the number given in the absolute maximum ratings, whichever is lower. note 3: the package material for these devices allows much improved heat transfer over our standard ceramic packages. in order to take full advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the printed circuit board. without this additional heat sinking, device power dissipation must be calculated using junction-to-ambient, rather than junction-to-case, thermal resistance. it must not be assumed that the device leads will provide substantial heat transfer out of the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package base. the stated junction-to-case thermal resistance is for the package material only, and does not account for the additional thermal resistance between the package base and the printed circuit board. the user must determine the value of the additional thermal resistance and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device. note 4: human body model, 100pf discharged through 1.5k ohms 3
microcircuit data sheet mnlm2940-12-x rev 1a1 recommended operating conditions (note 1) input voltage 26v operating temperature range -55 c < ta < +125 c note 1: absolute maximum ratings are limits beyond which damage to the device may occur. operating ratings are conditions for which the device is functional, but do not guarantee specific performance limits. for guaranteed specifications and test conditions see the electrical characteristics. the guaranteed specifications apply only for the test conditions listed. some performance characteristics may degrade when the device is not operated under the listed test conditions. 4
mnlm2940-12-x rev 1a1 microcircuit data sheet electrical characteristics dc parameters: (the following conditions apply to all the following parameters, unless otherwise specified.) dc: vin = 17v, io = 1a, cout = 22uf symbol parameter conditions notes pin- name min max unit sub- groups vout output voltage vin = 17v, io = 5ma 11.64 12.36 v 1 11.40 12.60 v 2, 3 vin = 13.6v, io = 5ma 11.64 12.36 v 1 11.40 12.60 v 2, 3 vin = 14v, io = 5ma 11.64 12.36 v 1 11.40 12.60 v 2, 3 vin = 26v, io = 5ma 11.64 12.36 v 1 11.40 12.60 v 2, 3 vin = 17v, io = 1a 11.64 12.36 v 1 11.40 12.60 v 2, 3 vin = 13.6v, io = 1a 11.64 12.36 v 1 11.40 12.60 v 2, 3 vin = 13.6v, io = 50ma 11.64 12.36 v 1 11.40 12.60 v 2, 3 vin = 17v, io = 50ma 11.64 12.36 v 1 11.40 12.60 v 2, 3 reverse polarity input voltage dc ro = 100 ohms 1 -15 v 1, 2, 3 iq quiescent current vin = 17v, io = 5ma 0 15 ma 1 0 20 ma 2, 3 vin = 14v, io = 5ma 0 15 ma 1 0 20 ma 2, 3 vin = 26v, io = 5ma 0 15 ma 1 0 20 ma 2, 3 vin = 17v, io = 1a 0 50 ma 1 0 60 ma 2, 3 vrline line regulation 14v < vin < 26v, io = 5ma -75 75 mv 1 -120 120 mv 2, 3 vrload load regulation vin = 17v, 50ma < io < 1a -120 120 mv 1 -190 190 mv 2, 3 5
mnlm2940-12-x rev 1a1 microcircuit data sheet electrical characteristics dc parameters:(continued) (the following conditions apply to all the following parameters, unless otherwise specified.) dc: vin = 17v, io = 1a, cout = 22uf symbol parameter conditions notes pin- name min max unit sub- groups vdo dropout voltage io = 1a 0 0.7 v 1 0 1 v 2, 3 io = 100ma 0 200 mv 1 0 300 mv 2, 3 isc short circuit current vin = 17v 1.6 a 1 1.3 a 2, 3 ac parameters: (the following conditions apply to all the following parameters, unless otherwise specified.) ac: vin = 17v, io = 1a, cout = 22uf max line transient vo < 13v, ro = 100 ohms, t = 20ms 1 40 v 7, 8a, 8b reverse polarity input voltage transient t = 20ms, ro = 100 ohms 1 -45 v 7, 8a, 8b no output noise voltage vin = 17v, io = 5ma, 10hz = 100khz 1 0 1000 uvrms 4, 5, 6 zo output impedance vin = 17v, io = 100ma dc and 20ma ac, fo = 120hz 1 1 ohm 4, 5, 6 rr ripple rejection vin = 17v, 1vrms, f = 1khz, io = 5ma 1 52 db 4 1 46 db 5, 6 note 1: functional test only. 6
microcircuit data sheet mnlm2940-12-x rev 1a1 graphics and diagrams graphics# description 05826hra2 metal can (ka), to-3, 2ld, low profile (b/i ckt) 06332hra2 cerdip (j), 16 lead (b/i ckt) 06351hra1 cerpack (w), 16 lead (b/i ckt) j16arl cerdip (j), 16 lead (p/p dwg) k02cre metal can (ka), to-3, 2ld, low profile (p/p dwg) p000137a metal can (ka), to-3, 2ld, low profile (pinout) p000159a cerdip (j), 16 lead (pinout) p000386a ceramic soic (wg), 16 lead (pinout) wg16arc ceramic soic (wg), 16 lead (p/p dwg) see attached graphics following this page. 7

n mil/aerospace operations 2900 semiconductor drive santa clara, ca 95050 bottom view lm2940k-xx/883 2 - lead to3 connection diagram p000137a bottom view input output ground (case)
n mil/aerospace operations 2900 semiconductor drive santa clara, ca 95050 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 nc nc nc nc nc nc nc v out nc gnd gnd gnd gnd gnd nc v in lm2940j-xx 16 - lead dip connection diagram top view p000159a
n mil/aerospace operations 2900 semiconductor drive santa clara, ca 95050 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 nc nc nc nc nc nc nc out nc gnd gnd gnd nc nc nc v in lm2940wg 16 - lead ceramic soic connection diagram top view p000386a

microcircuit data sheet mnlm2940-12-x rev 1a1 revision history rev ecn # rel date originator changes 0a0 m0000588 10/08/99 barbara lopez initial release of: mnlm2940-12-x rev 0a0. added note for power dissipation and reference to thermal resistance for aluminum nitride package. 1a1 m0003226 10/08/99 rose malone update mds: mnlm2940-12-x, rev. 0a0 to mnlm2940-12-x, rev. 1a1. moved reference to controlling document to feature section. added graphic's, reference to wg pkg to main table and absolute section and also package weight heading. changed vdo, io = 100ma, max. condition for subgroup 1 from 150mv to 200mv and subgroup 2 from 200mv to 300mv. 8

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